Monday 17th April 2023 starting at 18:30 CET

18:30 Pre-conference networking drinks reception sponsored by EPIC

Tuesday 18th April 2023 starting at 08:00 CET

08:00 Registration and welcome refreshments. 08:50 Housekeeping by Chris Meadows, Conference Chair Taking the power from silicon 09:00 Ge substrates for photonics applications – MOCVD growth, cost advantages of Ge recycling and new device possibilities Presented by Ivan Zyulkov - Umicore 09:15 Will wide bandgap power electronics market hit $10 billion and beyond? Presented by Callum Middleton - Omdia 09:30 Characterization of Thin Films and Critical Dimensions in Silicon Carbide and Gallium Nitride Process Presented by Aseem Srivastava - Onto Innovation 09:45 Streamlining SiC Boule Fabrication – Hardinge’s BoulePro 200 Invents Low-Cost Boule Shaping Presented by Jeff Gum - Hardinge 10:00 Tight process control for GaN-based power devices: The Potential of connected metrology in semiconductor device production Presented by Kolja Haberland - LayTec AG 10:15 Mass volume manufacturing of 8-inch GaN-on-Si discrete and Integrated power devices: bringing efficiency and operating frequency to the next level Presented by Denis Marcon - Innoscience Europe BV 10:30 Silicon carbide enabling true mass electrification Presented by Manuel Gärtner - STMicroelectronics 10:45 Morning Break 11:20 High throughput Epitaxy Solution for Compound Semiconductors Presented by Nicolas Muesgens - Aixtron 11:35 Plasma-Polish Dry Etch: Smoothing solution to prepare Epi-Ready SiC for Power Applications Presented by Amandev Singh - Oxford Instruments 11:50 The BelGaN Innovation Factory & GaN Valley: “Building a Wide Bandgap Semiconductor Innovation Ecosystem in Europe” Presented by Marnix Tack - BelGaN 12:05 Accelerating Adoption of Wide-Bandgap Power Semiconductors through Better Epitaxy of GaN and SiC Technologies Presented by Javier Banos - Veeco 12:20 Complex device design using predictive modelling Presented by Ahmed Nejim - Silvaco 12:35 Speeding up XRT Defect Recognition for SiC Presented by Christian Kranert - Fraunhofer IISB (speaking on behalf of Rigaku) 12:50 Lunch Break Making headway with the microLED - Sponsored by Precision Fabricators Ltd 14:15 Fast-ALD Solutions to Enable MicroLED Adoption Presented by Matt Weimer - Forge Nano 14:30 Optimising the process for making microLEDs Presented by Steven DenBaars - University of California Santa Barbara (UCSB) 14:45 Thin film layers for the upcoming micro-LED displays – the race never stops! Presented by Franz Xaver Lenherr - Evatec AG 15:00 Wafer bonding: technology that enables microLED microdisplays Presented by Anton Alexeev - EV Group 15:15 Afternoon Break 15:50 “NEXT LEVEL EPITAXY” - First state-of-the-art high performance production epitaxy system Presented by Ghassan Barbar - Element3-5 GmbH 16:05 Exploiting the Benefits of DynamicPixelTuning® for MicroLEDs Presented by Tongtong Zhu - Porotech Ultrafast communication: New Generations and higher efficiencies 16:20 High Volume Manufacturing engineered GaN material solutions for high-efficiency RF & Power devices Presented by Marianne Germain - Soitec 16:35 A growing Telecom Infrastructure Market for GaN RF as opportunities for GaN-on-Si Presented by Aymen Ghorbel - Yole Group 16:50 Taking 100-V RF GaN to New Heights Presented by Sebastian Krause - Fraunhofer IAF 17:05 Closing Remarks 17:10 Networking Drinks / Dinner Reception

Wednesday 19th April 2023 starting at 08:00 CET

08:00 Registration and welcome refreshments. 08:50 Housekeeping by Chris Meadows, Conference Chair New vectors for the VCSEL 09:00 Extending the spectral range with InP tunnel-junction VCSELs Presented by Christian Neumeyr - Vertilas 09:15 New Trends in VCSEL Technology Presented by Roman Koerner - TRUMPF 09:30 Consumer applications: A sweet spot for SWIR VCSELs Presented by Ali Jaffal - Yole Group 09:45 Capability Advancement of Production MBE for Next Generation Compound Semiconductors Presented by Paul Pinsukanjana - Intelligent Epitaxy Technology, Inc. (on behalf of Riber) 10:00 Morning Break 10:45 Plasma Dicing of GaAs VCSELs Presented by James Weber - Panasonic Connect 11:00 Building VCSELs on silicon Presented by Leah Espenhahn - UIUC Taking the power from silicon 11:15 New workflows for resolving compound semiconductor defectivity issues using destructive and non-destructive electron microscopy techniques Presented by Micah Ledoux - Thermo Fisher Scientific 11:30 Bruker X-ray solutions for GaN power device metrology Presented by John Mallows - Bruker 11:45 Total solutions for Silicon Carbide from wafer making to device making Presented by Gerald Klug - DISCO HI-TEC EUROPE GmbH 12:00 Lunch Break 13:15 Powerful metrology use cases - Addressing compound material industry needs Presented by Gábor Szendrei - Semilab 13:30 Scaling Manufacture of Compound Semiconductor Devices Presented by Brian Stickney - C & D Semiconductor Ultra-wide band gap devices: The ultimate solution? 13:45 Advanced Process Control for Rapid Scaling of Next Generation Materials Presented by Julie Orlando - Nanotronics 14:00 Gallium Oxide – The next revolution in power electronics Presented by Martin Kuball - Bristol University 14:15 Afternoon break 15:00 Underpinning the growth of gallium oxide devices Presented by Akito Kuramata - Novel Crystal Technology 15:15 Cost Advantage of Wide Band Gap Semiconductors Presented by Oluwasayo Loto - Yole Group 15:30 Building better gallium oxide devices via HVPE Presented by Heather Splawn - Kyma Technologies 15:45 Closing Remarks