Two days, five themes, over 30 inspiring presentations

Presentations were grouped into five key themes which collectively provided complete coverage of the compound semiconductor industry.

The CS International conference attracted industry leading experts from all the major companies involved in the compound semiconductor industry.

If you are interested in speaking at CS International 2019, please contact info@cs-international.net or call +44 (0)24 76718970.


2019 Speakers Include

Felix Grawert
Hiromi Fujita
Samuel Sonderegger
Mikko Soderlund
Andy Sellars
Liyang Zhang
Markus Behet
Edward Wasige
Speaker Name TBC
Marco Malinverni
Phil Greene
Paul Wiener
Farid Medjdoub
Richard Eden
Norbert Lichtenstein
Bernadette Kunert
Mohammed Alomari
Gabriele Formicone
Valery Tolstikhin
Speaker Name TBC
Benoit Ravot
Julie Orlando
Ke Xu
Gong Xiao
Scott Vasquez
Cem Basceri
Speaker Name TBC
Aly Mashaly
Qing Wang
Masahiro Murayama
Eric Higham
Mark McKee
David Danzilio
Ralf Lerner
Hong Lin


  Targeting transportation


Giving Formula E racing cars an edge with SiC

Aly Mashaly - ROHM Semiconductor

In automotive applications, requirements like space, weight and high efficiency play an increasing role. This leads to more demanding design requirements on the system and component level and ultimately affects the overall consistence of power devices, passive components, cooling technologies and PCBs. In consequence, Silicon Carbide (SiC) has become of higher interest in recent years. This presentation will focus on: SiC Technology and trends; the Benefit of SiC for the power train inverter, with a case study from Formula e racing car; and the benefit of utilizing SiC in personal vehicles (serial cars).



Improving electric vehicles with GaN

Paul Wiener - GaN Systems

The design challenge for tomorrow’s generation of electric vehicles continues to intensify with a clear focus on the search for maximizing range, faster charging, and lower cost electrification systems. Gallium Nitride (GaN) power transistors are a significant part of addressing these industry challenges by enabling the creation of smaller, lighter, lower cost, and more efficient power systems that are free from the limitations of yesterday’s silicon-based solutions. By effectively changing the rules of transistor power electronics for the auto industry, GaN technology will enable EV companies to not only create new game changing products for their own business, but in the end - revolutionize the entire transportation industry and transform the world.

During this session, attendees will learn and understand the details of how GaN technology is being used in automotive (specifically - review applications in charger, DC/DC and traction inverter) and other markets such as industrial aerospace, data centers and consumer electronics. The ROI of GaN technology - the maturity of the technology and the benefits that go beyond just the bill of material. This will be discussed through real life examples with data to support. The maturity of the GaN technology market at this point in time. 



  Pushing the performance envelope - Sponsored By


Making lasers on silicon

Bernadette Kunert - imec

Awaiting abstract.



Increasing the Power of Solid-State RF Amplifiers

Gabriele Formicone - Integra

The latest advances in GaN on SiC technology to increase the power of RF amplifiers for radars and other applications are reported. State-of-the-art discrete and pallet amplifier technology based on 50 VDC AlGaN/GaN HEMT on SiC is presented. Additionally, the latest efforts to increase power by exploring innovative transistor designs suitable for operation at 100-150 VDC are presented. Unlike 600 V GaN devices designed for low frequency DC-DC converters, the presentation addresses design goals for 600 V RF GaN transistor amplifiers capable of operating at 100-150 VDC in radar transmitters and other RF systems from UHF to L and S-band, and to C and X-band through additional innovations.



Superior superluminescent LEDs

Marco Malinverni - Exalos

Visible Superluminescent LEDs with red, green and blue (RGB) emission wavelengths are interesting light sources for display applications and architectures based on scanning MEMS mirrors, LCOS devices or holographic spatial modulators. EXALOS has developed efficient SLED devices at those primary colours over the past years. Here, we report on the improvement of the luminous and electro-optical efficiency of GaN-based SLEDs emitting in the green spectral range (λ > 500 nm). In addition, we present the results of blue and red SLEDs and discuss the challenges that still need to be tackled.


  Speeding communication


More data: More wireless or more fibre

Eric Higham - Strategy Analytics

Data traffic continues to increase at breakneck speed and emerging 5G applications are likely to quicken this pace. The challenge for service providers and network operators is the most cost effective way to move this data from point of origin to the end user without creating network bottlenecks that put the brakes on growth. This presentation will address some wireless and fiber network architectures that are evolving to support the data traffic explosion, looking at their advantages and disadvantages. We will also discuss the relative merits of different compound semiconductor technologies that will enable these architectures.



Supporting the build-out of 5G with our GaN-on-SiC process

David Danzilio - WIN Semiconductors

Awaiting abstract.



Mm-wave/THz Multi-Gigabit Wireless Links – the iBROW Project

Edward Wasige - EU Project/IBROW Project

This talk will report on the iBROW (Innovative ultra-BROadband ubiquitous Wireless communications through terahertz transceivers) project, a European Commission (EC) funded Horizon 2020 project to develop a novel, energy-efficient and compact ultra-broadband short-range wireless communication transceiver technology, seamlessly interfaced with optical fibre networks and capable of addressing envisaged future network needs. On iBROW, resonant tunnelling diode (RTD) oscillators in chip form at both W-band and J-band with around 1 mW output power were demonstrated. These have been used in laboratory wireless experiments and have supported data rates of over 10 Gb/s over several metres with correctable bit-error-rate (BER) using simple amplitude shift keying (ASK). RTDs operate at room temperature, are compact, low power and can also be designed as photodetectors (PD). On iBROW, RTD-PDs have enabled microwave-photonic interfaces of up to 100 Mbaud optical data transmission using QPSK.



Targeting mm-wave communications with wafer-level integration of InGaAs HEMTs and silicon CMOS

Gong Xiao - National University of Singapore/MIT Alliance

Future millimetre-wave communication applications, such as 5G mobile and wireless, require circuits with superior performance, reduced interconnect power consumption, lower cost, and a smaller chip footprint. A promising technology enabler is the monolithic or heterogeneous integration of InGaAs HEMTs and Si CMOS to realize hybrid circuits that exploit the benefits of both III-V and Si platforms. In this talk, I will discuss our recent progress on the growth of various III-V layers with high quality and uniformity on large-scale Si substrate, fabrication of high performance InGaAs HEMTs with Si-CMOS compatible front-end process, and the realization of heterogeneous integration of InGaAs HEMTs with Si CMOS on the 200 mm Si substrate. 



Fabless PICs in InP: Why, What, and How?

Valery Tolstikhin - Intengent

As PICs in InP are gaining momentum, their areas of application multiply and end users move up in a food chain. PICs are becoming customized, while their development goes beyond the means of the users. Fabless model is emerging as a solution, but its advancement depends on whether it meets the needs for customization and scalability. The regrowth-free taper-assisted vertical integration (TAVI) is a versatile technology that allows to decouple epitaxial growth and wafer fabrication, such that continuous development into production of fully custom InP PICs is achievable by outsourcing both to industrial-grade foundries. Referring to the TAVI technology, the talk will review the status and prospects of the fabless PICs in InP.


  Propelling the power electronics revolution


Is the infrastructure in place to ramp SiC and GaN production?

Richard Eden - IHS Markit

This presentation will share key findings from the latest IHS Markit Technology report on Silicon Carbide and Gallium Nitride Power Semiconductors. It will present the likely key applications, pricing trends, the supplier landscape and up-to-date ten-year forecasts by application for both technologies. It will identify which technologies can compete with silicon in terms of device type and likely adoption by end applications. The SiC & GaN wafer substrate supply chain will also be discussed. Finally, I will try to answer the question: Is the infrastructure in place to ramp up production of SiC and GaN power semiconductors?



Increasing the blocking voltage of GaN HEMTs

Farid Medjdoub - IEMN

GaN-based switches will offer greater efficiency, power handling, and compactness compared with the well-established, widely available silicon MOSFET power devices—all factors that are critical to meeting the needs of today’s systems. However, the vertical breakdown voltage of GaN-on-silicon heterostructures is currently limited to slightly above 1000 V, preventing this technology from benefiting higher voltage applications. This talk will discuss some potential solutions for next-generation, lateral GaN-on-silicon power devices targeting 1200 V and above. This would pave the way to a much lower on-resistance than other existing technologies operating above 1 kV. 




Printing GaN HEMTs onto silicon CMOS

Ralf Lerner - X-Fab

Awaiting abstract.


  Opportunities for LED and lasers


Accelerating Photonics Growth through Advances in High Performance As/P MOCVD and Wet Processing Technology

Mark McKee - Veeco

Photonics devices based on Arsenic/Phosphide (As/P) materials such as VCSELs and EE lasers are seeing high demand in 3D sensing, LiDAR, data communication, infrared illumination and fiber pumping. Double-digit growth over the next five years is expected as existing applications proliferate and new applications become available [1]. Manufacturers of photonics devices rely on Metal Organic Chemical Vapor Deposition (MOCVD), Lithography, and Wet Processing technology and equipment for their device production needs. As the critical first step in device manufacturing, MOCVD epitaxial growth technology must lead the way to meet growing customer demand for tighter performance requirements by improving compositional uniformity and dopant control while reducing cost-per-wafer via higher productivity, best-in-class yields and lower operating expenses. For epitaxy growth in VCSELs, key parameters are excellent within-wafer, wafer-to-wafer and run-to-run thickness uniformity of the DBR and MQW layers as well as the Fabry-Perot cavity dip uniformity. Equally important for VCSELs are the compositional and doping uniformity as well as background carbon and oxygen levels. The epitaxy films must also have very low defectivity. The above also holds true for EE lasers, except they do not include DBR layers. This presentation will use data to demonstrate how device manufacturers can use a new As/P MOCVD platform to achieve excellent uniformity and repeatability over long campaigns. Wet Processing is also critical for these photonics applications as the epitaxy layers must be patterned in the production process. Patterning is done using wet etch and metal lift off (MLO). Critical parameters for wet etch include etch uniformity and endpoint detection. Highly uniform film layers enable superior device performance and yield. In addition, a production-proven solvent-based process for MLO and photoresist strip steps is required to create the pad layers. This presentation will also show how immersion followed by spray enables complete removal for difficult to remove resists at high throughput.



Antimonide LEDs for gas sensing

Hiromi Fujita - Asahi Kasei

Unlike visible to near-infrared light, mid-infrared (mid-IR) light has attracted much less attention within the compound semiconductor community, due to limited commercial applications. However, the situation is changing. Following the recent concern surrounding global warming, technologies for monitoring and reducing greenhouse gases, such as carbon dioxide (CO2) and methane (CH4), are attracting a lot of attention. Among them, gas sensing technology based on mid-IR light absorption can take an important role. Antimonide LEDs and sensors, which have a narrow-bandgap and work in the mid-IR region, are ideal light sources and detectors for such application. In this presentation, recent progress in antimonide devices will be reported.



The tremendous opportunities for the VCSEL

Norbert Lichtenstein - II-VI

Historically VCSEL have addressed mostly niche applications such as simple sensing of gases or in oscillators of atomic clocks. With the application in datacom for short reach connections in data centers or smart cables first high volume applications have been arising. Now new applications such as the upcoming smart touch interfaces, people detection, face recognition or 3D scanning are completely changing the human-machine interface. The implementation of these applications in a plurality of compact consumer devices such as smartphones and tablets, TV, PCs & notebooks, virtual reality devices, smart home / IoT, automotive & drones or gaming only is possible by the exceptional properties of the VCSEL such as efficiency, temperature stability and high volume manufacturability. Future applications are expected in autonomous driving and going forward in augmented and virtual reality. 



Mastering the manufacture of microLEDs on silicon

Liyang Zhang - Enkris

For micro LED displays, monolithic integration of arrays is a preferable approach to producing high-resolution displays, because it can directly transfer a processed LED wafer to a target backplane through wafer-bonding technology. For this approach, production ideally involves the use of large, flat epi-wafers with a narrow wavelength bin range and a low defect level. These characteristics are critical to improve the final yield. GaN-on-silicon technology offers tremendous potential to address these epitaxy requirements over incumbent sapphire technology. Our recent progress on the growth of GaN-on-silicon epiwafer for micro LED displays will also be discussed



Watt-class blue and green lasers

Masahiro Murayama - Sony Corporation

High-power visible laser diodes have recently attracted a great deal of attention as light sources for display applications such as high brightness and large-sized projectors. We present high-power and high-efficiency blue and green lasers which were fabricated on free standing c-plane and semipolar {20-21} GaN substrates, respectively. We have successfully achieved more than 5 W output power operation for our 465 nm-blue lasers and 2 W for our 530 nm-green ones. These lasers are promising light sources for future laser display applications meeting the ITU-R Recommendation BT.2020.


  Theme To Be Decided


Presentation Title TBC

Felix Grawert - AIXTRON

Awaiting abstract.



Presentation Title TBC

Samuel Sonderegger - Attolight

Awaiting abstract.



Presentation Title TBC

Mikko Soderlund - Beneq

Awaiting abstract.



Presentation Title TBC

Markus Behet - EpiGaN

Awaiting abstract.



Presentation Title TBC

Speaker Name TBC - Evatec

Awaiting abstract.



Presentation Title TBC

Phil Greene - Ferrotec

Awaiting abstract.



Presentation Title TBC

Speaker Name TBC - KLA-Tencor

Awaiting abstract.



Presentation Title TBC

Benoit Ravot - Nanometrics

Awaiting abstract.



Presentation Title TBC - IMS Chips

Mohammed Alomari - IMS Chips

Awaiting abstract.



Presentation Title TBC

Julie Orlando - Nanotronics

Awaiting abstract.



Presentation Title TBC

Scott Vasquez - Qorvo

Awaiting abstract.



Presentation Title TBC

Ke Xu - Nanowin

Awaiting abstract.



Presentation Title TBC

Speaker Name TBC - Revasum

Awaiting abstract.



Presentation Title TBC

Qing Wang - Sino Nitride Semiconductor

Awaiting abstract.



Presentation Title TBC

Hong Lin - Yole Développement

Awaiting abstract.



Presentation Title TBC

Andy Sellars - CS Catapult

Awaiting abstract.



Presentation Title TBC - Qromis

Cem Basceri - Qromis

   




*All speakers and presentations are subject to change.

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