PRESENTATION

Wafer bonding: technology that enables microLED microdisplays

Microdisplay roadmap is driven by extreme performance, brightness, size and pixel density demands of applications like augmented reality. These displays must be several millimetres in size, have high refresh rate and achieve resolutions beyond the ultra-high-definition standards. As a result, efficient volume manufacturing can be achieved only by advanced semiconductor node processes. Moreover, the extreme brightness requirements make microLEDs the most feasible pixel solution. This sets another challenge: heterogeneous integration of the LED compound semiconductor structures and the CMOS driver wafers. Advanced die to wafer and wafer to wafer bonding solutions must be used. This presentation will be devoted to a broad range of wafer-level manufacturing technologies that will enable the volume manufacturing of microLED microdisplays and their integration into devices.