Microdisplay roadmap is driven by extreme performance, brightness, size and pixel density demands of applications like augmented reality. These displays must be several millimetres in size, have high refresh rate and achieve resolutions beyond the ultra-high-definition standards. As a result, efficient volume manufacturing can be achieved only by advanced semiconductor node processes. Moreover, the extreme brightness requirements make microLEDs the most feasible pixel solution. This sets another challenge: heterogeneous integration of the LED compound semiconductor structures and the CMOS driver wafers. Advanced die to wafer and wafer to wafer bonding solutions must be used. This presentation will be devoted to a broad range of wafer-level manufacturing technologies that will enable the volume manufacturing of microLED microdisplays and their integration into devices.
Dr. Anton Alexeev is Business Development Manager at EV Group, where he focuses on wafer bonding technologies for a variety of applications, in particular micro-LED displays.Anton received his PhD in electrical engineering from the Eindhoven University of Technology where he also graduated Professional Doctorate in Engineering program in physics. He has years of professional experience in the semiconductor industry. He worked on variety of technologies ranging from visible light communication via LED with Philips Lighting to optimization of the overlay performance for the leading-edge semiconductor manufacturing nodes with ASML.