Compound semiconductors have attracted a lot of attention as post-Si semiconductors in various fields such as high frequency, light, and power devices become more popular. Among them, vertical-cavity surface-emitting lasers (VCSELs) are now key optical sources in gigabit ethernet high-speed optical-area networks and computer links, due to their low threshold current and small structure. Panasonic will introduce its latest developments in dry etching processes, especially the application of plasma dicing for GaAs VCSEL wafers.
James Weber has a degree in Mechanical Engineering from the University of Adelaide in Australia. Since graduating, he has held roles in Field Engineering, Project Management and Sales for different companies, namely in the oil and gas and semiconductor industries. Since 2016 he is the Senior Business Development Manager for Microelectronics Equipment at Panasonic Connect Europe. James’ main target is the establishment of new business opportunities in the European backend and frontend semiconductor industry in the fields of Flip-chip Bonding, Plasma Cleaning, Dry Etching and Plasma Dicing Technologies.