PRESENTATION
Scaling Manufacture of Compound Semiconductor Devices
As the manufacture of compound semiconductor devices increases the variation in unit operations needs addressing to scale production. Variations in manufacture include: wafer size; substrate materials; transparent & opaque substrates; wafer thickness; materials used to build devices; reactivity of materials with process chemicals; device/substrate isolation; pyrophoric substrates & layers; brittleness; device specific unit operations. Most compound semiconductor fabs are not dedicated to specific devices or substrates. The presentation reviews fab requirements and demonstrates how the range of requirements can be addressed economically for fab modernization, expansion and addition of new technologies through equipment design and optimization; using deployed solutions.
Brian Stickney
C & D Semiconductor
Brian Stickney is responsible for Applications Engineering, Customer Service and International Sales for C&D Semiconductor. He has more than 30 years of semiconductor industry experience in engineering, marketing, sales and senior management roles. In addition to working for several large IC manufactures and Semiconductor Equipment supplier has been part of two successful semiconductor equipment startups. His applications experience covers the full range of wafer fabrication unit operations as well as test and packaging. He holds a masters degree in chemical engineering from the University of Florida and bachelor’s degree in chemical engineering from Tufts University.