The presentation introduces the activities of the Center of Expertise for X-ray topography (XRT), a research collaboration between the device manufacturer Rigaku and the research institute Fraunhofer IISB, particularly regarding dislocation detection in SiC. We will show our recent achievements in the field: The first point covers the detection of threading screw dislocation (TSD) which we developed to a highly reproducible and reliable measurement. Based on this development, TSD detection by XRT has become a SEMI Standard, making this approach a common language in the industry. The same thing is currently going on for basal-plane dislocations, for which we will particularly introduce FastBPD: High-speed full wafer BPD density mapping, taking only 5 minutes for a 150mm wafer to complete.