Brian Stickney is responsible for Applications Engineering, Customer Service and International Sales for C&D Semiconductor. He has more than 30 years of semiconductor industry experience in engineering, marketing, sales and senior management roles. In addition to working for several large IC manufactures and Semiconductor Equipment supplier has been part of two successful semiconductor equipment startups. His applications experience covers the full range of wafer fabrication unit operations as well as test and packaging. He holds a masters degree in chemical engineering from the University of Florida and bachelor’s degree in chemical engineering from Tufts University.
SiC devices are driving major changes in the use and consumption of power, enabling a more environmentally friend way of living. The aggressive adoption rate requires expanding manufacturing levels and accelerating product development. The basic process technology and wafer sizes can be accommodated in silicon wafer fabs that are currently dormant or at low production levels. Additionally, green field manufacturing facilities are being build, with large amounts of capital committed to the growth and adoption of SiC devices. This talk presents systems designed for efficient use of capital for manufacturing and R&D expansion: pricing that enables expanding capital purchases; operational efficiency provided by high system availability and reliability with low consumable cost.